Infra- structure
Structuring and deposition methods
- Roll-to-roll plant with nanoimprint lithography
- Nanoimprint lithography in a batch process (up to 4 x 4 inch)
- Industrial vacuum deposition facilities for hybrid PLD process (magnetron cathode sputtering and ion beam deposition), max. vacuum chamber diameter 500 mm, coating height 400 mm
- Low temperature sputtering system (max 50 °C substrate temperature)
- High-resolution laser lithography
- Electron beam lithography
- Photo lithography
- 2 chamber high-vacuum deposition unit with sample and mask transfer
- Seperate high-vacuum systems for organic and inorganic deposition
- Parylene deposition (surface polymerisation)
- Inkjet printing
- Reactive ion etching (anisotropic etching)