Infra- structure

Surface, film and material characterisation methods

  • Automated drying and poling of piezoelectric and pyroelectric sensors
  • Surface morphology by scanning electron microscopy (SEM) or atomic force microscopy (AFM)
  • Surface chemical analysis by x-ray photoelectron spectroscopy (XPS / ESCA, depth profiling)
  • Scanning tunnelling microscopy (STM)
  • Spectroscopic ellipsometry
  • Profilometry (stylus profilometer)
  • Film thickness measurement in the micrometer range using the spherical cap grinding method (calo test)
  • Measurement of residual film stress using the bending beam method
  • Contact angle measurement
  • Colorimetry
  • Viscosimetry
  • Zeta potential
  • Electrical characterisation of components using a parameter analyser
  • UV-VIS-NIR spectroscopy
  • Luminescence spectroscopy
  • Polarisation spectroscopy
  • Picosecond photophysics
  • Multiphoton spectroscopy and lithography
  • Light microscopie analysis
  • Photogonimetry
  • Quartz crystal microbalance with dissipation monitoring (QCM-D)
  • Thermal analysis (thermogravimetric analysis / differential scannig calorimetry - TGA / DSC)
  • Infrared spectroscopy
  • Metallography
  • X-ray fluorescence analysis (XRF)