e-Ramp: a strong team with 26 research partners from six countries
The focus of eRamp: research will focus on the rapid introduction of new production techniques and the additional exploration of packaging technologies for power semiconductors. The task facing the 26 research partners from six countries is to explore and develop new methods for more rapid starting production.
To examine the research results immediately for their practicality in the locations where the new manufacturing techniques will ultimately be used, the research partners use existing pilot lines and apply extensive manufacturing expertise in different locations. These include Dresden (Infineon: power semiconductors based on 300 mm chips), Reutlingen (Bosch: power semiconductors, smart power and sensors based on 200 mm chips) and Regensburg (Infineon packaging technology for power semiconductors). To evaluate newly developed chip embedding technology, Infineon, Osram and Siemens will fabricate and investigate test setups and demonstrators in close cooperation with one another.
The main task of the JOANNEUM RESEARCH POLICIES team within the framework of this project is to develop new prediction techniques in order to increase the reliability and yield of new chip technologies.