Materials

Wissenschaftliche Publikation

Thermal Stresses and Microstructure of Tungsten Films on Copper

Publikation aus Materials

Kapp M., Martinschitz K.J., Keckes J., DI DDr. mont. Jürgen Lackner, Zizak I., Dehm G.

BHM - Berg- und Hüttenmännische Monatshefte 153/7, pp. 273-277, 2008

Abstract:

Tungsten films on polycrystalline copper are considered as possible material systems for high heat flux components in fusion reactors like the International Thermonuclear Experimental Reactor (ITER). Since high thermal loads will occur at the reactor wall it is necessary to analyse temperature-induced stress evolution and possible microstructural changes. In this study the thermal stresses in tungsten films with different thicknesses are characterized by advanced in-situ X-ray diffraction techniques including synchrotron scattering. The microstructure and stress behaviour are critically discussed.

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