Thermal Stresses and Microstructure of Tungsten Films on Copper
Publikation aus Materials
Kapp M., Martinschitz K.J., Keckes J., Lackner J.M., Zizak I., Dehm G.
BHM - Berg- und Hüttenmännische Monatshefte 153/7, pp. 273-277, 2008
Tungsten films on polycrystalline copper are considered as possible material systems for high heat flux components in fusion reactors like the International Thermonuclear Experimental Reactor (ITER). Since high thermal loads will occur at the reactor wall it is necessary to analyse temperature-induced stress evolution and possible microstructural changes. In this study the thermal stresses in tungsten films with different thicknesses are characterized by advanced in-situ X-ray diffraction techniques including synchrotron scattering. The microstructure and stress behaviour are critically discussed.