Femtosecond Laser Micromachining
Ultrashort laser pulses to directly write 3D microstructures in a variety of different materials
credit: JOANNEUM RESEARCH / Bergmann
3D Microstructures: Written with Light
We use ultrashort laser pulses to directly write 3D microstructures into transparent materials. Our process combines precision, flexibility, and speed—ideal for rapid prototyping and advanced fabrication without the need for masks, chemicals, or cleanroom facilities.
Applications span from high-resolution micromachining via laser ablation to multi-photon lithography for waveguide writing and FLICE-based 3D hollow structures inside glass. Materials include glass, ceramics, metals, and polymers.
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Capabilities
- Laser Ablation: Precise surface and volume structuring of glasses, ceramics, metals, and polymers with micrometre resolution.
- Waveguide Writing: Directly inscribe optical circuits into glass via nonlinear absorption, inducing positive refractive index changes.
- 3D Glass Structuring (FLICE): Femtosecond Laser Induced Chemical Etching enables high-precision hollow 3D structures inside glass through a combination of ultrashort pulse exposure and selective wet etching.
Key Advantages
- Sub-micron accuracy
- True 3D fabrication inside materials
- Monolithic structures: no bonding or alignment
- Fast prototyping and development cycles
- Wafer-scale processing up to 200 × 200 mm
- Full-service support: from concept to tested component
Typical Applications
- Micro-optics: flat free-form lenses
- Integrated photonics: waveguides, couplers, Mach–Zehnder interferometers
- Precision machining: cutting, drilling & surface modification
- Quantum tech photonic glass chips
- Microfluidics
- MedTech & sensors
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