Step and Repeat UV-nanoimprint lithography
Replication of master structures almost seamlessly onto large surfaces (380 x 700 mm²) using a step&repeat UV-NIL process
Step and Repeat-Anlage Foto: JOANNEUM RESEARCH/Stadler
Using the Step&Repeat UV-NIL process, we replicate small master structures almost seamlessly onto large surfaces (380 x 700 mm²). We use this process for customised replications of micro and nanostructures or for the production of tools for our R2R pilot line.
Our offer
We offer our customers and partners research pilot lines for the development and implementation of new product ideas and manufacturing processes, from the idea to the prototype. The pilot line for roll-based micro- and nanostructuring at the MATERIALS Institute includes simulation, design and material development (coatings, imprint resins) and offers large-area structuring and structure replication from mastering to high-throughput production. The EVG770 NILStepper completes this pilot line with regard to the production of flexible working stamps for roller-based processes.
Advantages of nanoimprint lithography
Compared to other lithographic processes, nanoimprint lithography is a cost-effective structuring technology and ideal for use in high-volume manufacturing processes. The time and cost associated with the production of working stamps for industrial-scale, roll-based embossing is still significant. The development of Step+Repeat technology for large-area foil substrates enables us to bridge the gap between small-format masters and large-area working stamps.
Among other things, this brings significantly greater process flexibility and a further reduction in process costs in the area of nanoimprint technology. The adaptation of the EVG770 system together with EV Group primarily involved expanding the sample pick-up from wafer geometries to large-area film substrates.
Using a step+repeat technology based on UV embossing, flexible, polymer-based working stamps are created for use in roll-to-roll embossing processes. The approach combines the very high positioning accuracy of semiconductor technology with film-based high-throughput methods and provides a cost-effective and industrially suitable alternative to the direct use of conventional time-consuming nanostructuring processes.
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