Microassembly Lab

What does the Microassembly Lab for photonic and electronic assemblies offer? 

Design and production of optoelectronic components and devices from micrometre scale to (hybrid) macroscopic assemblies

• Electronic design
  EDA software Altium Designer for analogue and digital circuit design, including SPICE simulation; Xilinx and Intel PSG (Altera) design environment for FPGA and CPLD; micro-controller programming (e.g. with ARM KEILTools)
• Data and signal analysis
  MATLAB, GNU Octave and Simulink/Simscape; algorithm development and system modelling.
• Chip bonding platform
  This high-precision Tresky platform is capable of placing and bonding electronic components on surfaces with more than 10µ accuracy. The Tresky Chip Bonder features True Vertical Technology™, which guarantees parallelism between chip and substrate.
• SMD placement
  Neoden 4 pick & place machine
• Soldering processes
  Inert gas and forming gas reflow soldering up to 450° C (vacuum); vapour phase soldering system (oxygen-free reflow process); universal soldering and repair station (JBC).

Realisation of "Printed Electronics and Optics" through additive processes: Screen printing, inkjet printing/electrostatic inkjet printing (ESJet), aerosol jet printing and atmospheric pressure plasma jet processes. 

• Atmospheric pressure plasmajet coating system
  Atmospheric pressure plasmajet coating technologies (APPJ) do not require a vacuum chamber and are therefore subject to hardly any size restrictions with regard to the components to be coated. Possible applications include electrical insulation layers or conductor tracks and electrodes, etc.
• Inkjet printers
  Four modern inkjet printers are available, three PIXDRO LP50 platforms and a Dimatix DMP 2800 printing platform, which enable the use of the most important industrial print head types.
• Optomec aerosol jet printers
  Our aerosol jet printing process is a non-contact direct structuring process with high resolution (up to 10µm) and also enables the use of non-planar substrates and the creation of 2.5D structures.
• ESJET printer
  Electrostatic Jet Printing technology is used to apply functional inks in a viscosity range and droplet volume that is currently not available for conventional piezo-based inkjet technologies.
• Solenoid valve printers
  Compared to inkjet printing, this technology allows the application of larger drop volumes and working in a wider viscosity range with a larger minimum line width and lower possible printing frequency.
• Flexographic printing
  Highly viscous inks or pastes are applied to the ink application roller via a doctor blade, which then wets the prefabricated cliché with the structures to be transferred. In the roller-based process, the ink is then transferred from the cliché to the substrate to be printed.
• Thieme precision screen printing machine
  In screen printing, a highly viscous ink or paste is applied to the substrate via a pre-structured screen (stencil) using a doctor blade. Parameters such as squeegee speed, mesh fineness and mesh size of the screen determine the printing result.