Infra- structure

Structuring and deposition methods


  • Roll-to-roll plant with nanoimprint lithography
  • Nanoimprint lithography in a batch process (up to 4 x 4 inch)
  • Industrial vacuum deposition facilities for hybrid PLD process (magnetron cathode sputtering and ion beam deposition), max. vacuum chamber diameter 500 mm, coating height 400 mm
  • Low temperature sputtering system (max 50 °C substrate temperature)
  • High-resolution laser lithography
  • Electron beam lithography
  • Photo lithography
  • 2 chamber high-vacuum deposition unit with sample and mask transfer
  • Seperate high-vacuum systems for organic and inorganic deposition
  • Parylene deposition (surface polymerisation)
  • Inkjet printing
  • Reactive ion etching (anisotropic etching)