Light and Integration Laboratory
Spektral-Goniometer, Credit: JOANNEUM RESEARCH/Schwarzl
Light and Integration Laboratory
In the new Light and Integration Laboratory in Pinkafeld, a modern research infrastructure is available for cooperation with industrial partners: In addition to the light measurement technology and micro-assembly listed below, a closely networked laboratory with first-class electronic measurement technology is also available at the site. The possibilities are completed by competent employees and professional software for integrated optical and electronic design.
- Array spectroradiometer for both weak light sources and high radiation intensities from 300 nm to 1100 nm.
- Radiometric or photometric measurements and colorimetric characterization of all types of light sources
- Goniophotometer for test objects up to 1.3 m and a measuring distance of 12 m for angle-dependent determination of photometric parameters with export to Excel, IES and Eulumdat
- Integrating sphere with 1000 mm for determining the luminous flux in 2π and 4π configurations
- Mobile luminance and colorimetry cameras for screens and homogeneously illuminated surfaces
- Evaluation of displays based on LEDs, OLEDs or µLEDS
- Optical probes, remote controlled current and voltage sources, power meters, temperature meters and a dry storage cabinet
- Handheld spectrometer for measuring flicker, blue light hazard, illuminance and human centric lighting
- Light microscopic examinations
- Software-controlled micro-assembly system with motorized Z-axis and flip-chip camera for placement accuracy up to ±1 µm
- Flip-Chip bonding by means of soldering, gluing or ultrasonic
- Stamping and dispensing of solder pastes, adhesives e.g. conductive on substrates
- Rapid prototyping with 3D printer
- CNC portal milling machine with 1400 x 800 x 110 mm processing size
- Pick & Place machine for placing smd components in larger quantities on printed circuit boards
- Universal soldering, desoldering and repair station with hot air
- Inert and forming gas reflow soldering oven up to 450° C and for brazing processes under vacuum
- Vapor phase soldering system for oxygen-free reflow processes without overheating
- 3D-Scanner for high resolution scanning of objects with fine details