- Automated drying and poling of piezoelectric and pyroelectric sensors
- Surface morphology by scanning electron microscopy (SEM) or atomic force microscopy (AFM)
- Surface chemical analysis by x-ray photoelectron spectroscopy (XPS / ESCA, depth profiling)
- Scanning tunnelling microscopy (STM)
- Spectroscopic ellipsometry
- Profilometry (stylus profilometer)
- Film thickness measurement in the micrometer range using the spherical cap grinding method (calo test)
- Measurement of residual film stress using the bending beam method
- Contact angle measurement
- Colorimetry
- Viscosimetry
- Zeta potential
- Electrical characterisation of components using a parameter analyser
- UV-VIS-NIR spectroscopy
- Luminescence spectroscopy
- Polarisation spectroscopy
- Picosecond photophysics
- Multiphoton spectroscopy and lithography
- Light microscopie analysis
- Photogonimetry
- Quartz crystal microbalance with dissipation monitoring (QCM-D)
- Thermal analysis (thermogravimetric analysis / differential scannig calorimetry - TGA / DSC)
- Infrared spectroscopy
- Metallography
- X-ray fluorescence analysis (XRF)